For more than twenty years the SISPAD has brought together leading scientists, researchers, and students to share their latest developments in advanced modeling of novel semiconductor devices and fabrication processes.
The University of Udine is proud to host the conference in year 2019.
The conference will have a high-caliber technical program consisting of contributed and invited presentations, and of a poster session. Companion tutorials are planned for September 3, 2019. A pleasant social program will also be arranged.
More details on tutorials, invited speakers and social program will be announced as they become available.
For additional inquiries please contact the conference chairs.
We hope to see you at the University of Udine in the summer of 2019 !
David Esseni (University of Udine), Conference Chair
Pierpaolo Palestri (University of Udine), TPC co-Chair
Denis Rideau (University of Udine), TPC co-Chair