Wednesday-Friday, 4-6 September

Conference Committee:
Conference Chair: David Esseni, University of Udine
Technical Program Co-Chair: Pierpaolo Palestri, University of Udine
Technical Program Co-Chair: Denis Rideau, STMicroelectronics
Publication Chairman: Francesco Driussi, University of Udine

Honorary Committee:
R. Dutton, Stanford University, USA
S. Selberherr, TU Wien, Austria
K. Taniguchi, Osaka University, Japan

International Steering Committee:
A. Asenov, Univ. of Glasgow, UK
V. Axelrad, Sequoia Design Systems, USA
D. Esseni, University of Udine, Italy
N. Goldsman, University of Maryland, USA
J. Lorenz, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany
Y. Kamakura Osaka University, Japan
N. Mori, Osaka University, Japan
L. F. Register, University of Texas at Austin, USA
K. Sonoda, Renesas, Japan

Technical Program Committee:
Campbell Millar, Synopsys Inc, UK
Christoph Jungemann, University of Aachen, Germany
Geert Eneman, IMEC, Belgium
Susanna Reggiani, University of Bologna, Italy
Lado Filipovic, Technische Universit├Ąt Wien, Austria
Jurgen Lorenz, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany
Layla Martin-Samos Colomer, SISSA, Trieste, Italy
Pierpaolo Palestri, University of Udine, Udine, Italy
Sebastien Martinie, CEA-LETI, Grenoble, France
Denis Rideau, STMicroelectronics, France
Andreas Schenk, ETH Zurich, Switzerland
Andres Godoy, University of Granada, Spain
Victor Moroz, Synopsys, USA
Daniel Connelly, Atomera, USA
Sayed Hasan, Intel, USA
Guangrui (Maggie) Xia, The University of British Columbia, Canada
Sumeet Gupta, Purdue University, USA
William Vandenberghe, University of Texas at Dallas, USA
Seong-dong Kim, SK Hynix, South Korea
Kunikiyo Tatsuya, Renesas Electronics, Japan
Uihui Kwon, Samsung, South Korea
Yiming Li, National Chiao Tung University, Taiwan
Satofumi Souma, Kobe University, Japan
Jeff Wu, TSMC, Taiwan